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Micro component processing - メーカー・企業と業務用製品 | イプロスものづくり

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GOTO SEIKI Co., Ltd. - Precision Parts Processing

We respond to the growing demand for ultra-small precision parts processing in various fields.

GOTO Seiki Co., Ltd. specializes in the precision machining of extremely small components that are in high demand across various fields such as cameras, semiconductors, optical fibers, and connectors. We handle tiny parts ranging from about the size of a 10-yen coin to approximately the size of a grain of rice. Despite being small, our capabilities range from simple processes like drilling and grooving to complex shapes and three-dimensional forms. To achieve this, we create original mounting jigs and pursue positioning accuracy through repeated multi-process operations. Our cutting tools can combine to achieve a minimum radius of R0.05 and drilling diameters as small as Φ0.03, making the impossible possible. Burrs, which can be a significant issue during machining of tiny parts, are addressed through our pursuit of methods that eliminate them, and any remaining fine burrs are removed using our unique expertise. For more details, please contact us.

  • Processing Contract
  • Other optical parts
  • connector
  • Micro component processing

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What are the key points for miniaturizing and further refining micro components?

Publication of miniaturized and refined component processing technology for medical devices and semiconductor inspection parts!

We are considering miniaturizing our products, but we lack the manpower to process them in-house. If you are facing challenges such as being unable to respond technically, please consult with us. Aikosha specializes in NC precision machining and processes fine parts such as contact probes for electrical testing of fine components (semiconductors, printed circuit boards, etc.), medical device parts, and industrial equipment parts. With NC machining, we can handle fine parts with an outer diameter of "0.05 mm to 6.0 mm." In drilling operations, we have a technical track record of achieving a minimum hole diameter of "0.009 mm (depth 1.0 mm)," and we are committed to high-precision manufacturing. We are pursuing new fields where we can further utilize the fine processing technology and know-how we have cultivated over many years, particularly in semiconductor inspection parts. If you are considering further miniaturization or fine parts, please consult with us. Currently, we are partially showcasing examples of fine parts processing! *For more details, please download the catalog or contact us directly.

  • Processing Contract
  • Other semiconductors
  • Micro component processing

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